Your position:Home >> Capability

Item

Production 
Capacity

Process Description

Layer

1-32 Layers

Layer is the number of layers of the design file, and to the final announcement of the site prevail.

Materials Type

FR-4 

Materials Type:  FR-4, high-frequency plate, Rogers, For FR4,we use Kingboard KB6160A material and international A grade high TG material. 

Max. PCB size

550x1100mm

Only allowed to receive 500x500mm, and the larger size will add extra charge,pls contact our seller for details.

Contour tolerance

±0.1mm

Outline tolerance.

PCB Thickness

0.2--5.5mm

Produce: 0.4/0.6/0.8/1.0/1.2/1.6/2.0/2.4/3.0/4.0mm.

Thickness Tolerance ( T1.0mm)

± 10%

For example, the thickness T = 1.6mm, the physical thickness is 1.44mm (T-1.6 × 10%) ~ 1.76mm (T + 1.6 × 10%).

Min. Line Width/space

3mil/3mil0.75mm

Line width/space be possible greater than 3mil, and the minimum is not less than 3mil; for multiple layer board: both the inner and outer layer can not be less than 4mil(0.1mm).

Outer Layer Finished Copper Thickness

35um/105um(1OZ/3OZ

Refers to the thickness of the copper foil in the outer finished circuit board ,1 OZ35um 3 OZ=105um.

Inner Layer Finished Copper Thickness

17um(0.5 OZ)

Refer to the Finished Thickness of Multi Inner Layer Copper .

Min.Drilling hole(machine drill)

0.15mm

0.15mm is the min. hole , if conditions allowed we suggest to design it up to 0.3mm, aperture tolerance is ± 0.075mm.

Drilling Acuracy(machine drill)

±0.08mm

The tolerance of drilling hole is 0.08mm, for example, the hole is designed to be 0.6mm, and the finished hole of the real board is qualified in the 0.52--0.68mm.

Half Hole :Min Half Hole Diameter

0.5mm

Half hole process is a special process, and the min hole dia. should be bigger than 0.5mm.

Through-hole unilateral welding ring

0.1mm4mil

minimum Via  4mil, minimum component hole  6mil, increase the over-hole welding ring is helpful for the over-current.

Through-hole plug hole

0.5mm

Bigger than 0.5mm wll treat as through-hole cover oil.

Solder Type

Photosensitive ink

Photosensitive ink is the most common type now. The current colors are:  green, matt green, blue, red, yellow, black, matt black, white.

BGA pad

0.3mm

BGA pad designed less than 0.3MM will cause poor welding and the finished product performance is not good.

Solder mask Opening

0.1mm

Solder mask is often said green color, it can be done in the process of soldmask Bridge.

Min. solder mask bridge

0.075mm

Resistance welding bridge design requires line pad spacing is bigger than 0.18mm, the thicker copper the greater spacing. If there is no remarks, do not do solder bridge.

Min. Legend Width

0.6mm

If the minimum width of the Legend is less than 0.6mm, the actual board may not clear which caused by the design reasons.

Min. Legend Height

0.8mm

If the minimum height of the Legend is less than 0.8mm, the actual board may not clear which caused by the design reasons.

Legend Aspect Ratio

1:06

The most appropriate aspect ratio, more conducive to production.

Space between Line and Outline

0.25mm10mil

If come out by Routing, the distance between the line and the line layer should not less than 0.25mm; if come out by the V cut ,the distance from the center line to the V cutting line should not be less than 0.4mm.

Make-up: Gapless imposition

0gap

Clearance of the intermediate plate and the plate is 0.

Panelization: Gap Requires

1.6mm

This clearance gap should be not less than 1.6mm, otherwise routing is very hard.

Software support

PADS/ 99SE/DXP/CAD versions/Sprint-Layout /genesis/CAM350/U-CAM/gerber

Support variety of the industry design software and conversion gerber file (please remark whick version your engineer used for incompatibility problem and get the notice in the FQA).


Online Service